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Thermal processor instability can cause OS crash
Saturday, July 19, 2003 at 1:13 pm
Windows XP Annoyances Discussion Forum
Posted by ScientificProgrammer
(3 messages posted)
I was reusing an old heat sink (and fan) for building up an MSI motherboard. Since
the phase change thermal pad on the AMD Athlon heatsink is single use, I had to remove
the old thermal pad and replace it with a new one. The new thermal pad must be applied
evenly, without lumps or voids. Any lumps or voids in the thermal pad will cause
hot spots on the processor die, which will increase the likelihood of instability
and processor damage. The motherboard’s temperature sensor will not detect
these hotspots because the sensor is on the opposite side of the processor package
from the heat-producing die. Here’s what I did: First, I marked the location
of the old thermal pad. Then I scraped off most of the old thermal pad using a wooden
‘popsicle’ stick to avoid scratching the soft aluminum heatsink (a plastic
knife would also work). Then I removed the remaining residue of the old thermal
pad with a petroleum solvent. I rinsed away the petroleum residue with electronic
contact cleaner. I selected a 0.2mm thick Boron Nitride thermal pad with a thermal
resistance of 0.03degC/W for the new AMD processor. The new thermal pad came packaged
between two plastic (Mylar) sheets. I warmed the heat sink before applying the new
thermal pad to assist in adhesion. Remove the plastic sheet from one side of the
new thermal pad and apply it to the warm heat sink using gentle pressure. There
can’t be any air bubbles. The plastic sheet on the other side of thermal pad
may tend to stick and not release cleanly, which causes lumps and voids in the thermal
pad rendering it unusable. To avoid this problem, chill the heat-sink in the freezer
before attempting to remove the plastic sheet from the processor side of the new
thermal pad. This process should yield a smooth thermal pad without lumps or voids
for maximum heat transfer from the processor, without hotspots and thermal-induced
processor instability.
On Sunday, June 29, 2003 at 8:57 pm, JG wrote:
>Hello;
>
>I had this same isse with a PC. The PC was very dusty inside and the AMD processor
>heatsink was covered enough as to not let enough air through. So it seems the processor
>was getting too hot and causing WinXP to do a 'PAGE_FAULT_IN_NONPAGED_AREA'. After
>blowing out the system, the system seems to work very well now.
>
>
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All messages in this thread [show all]
 |  | | | | | | | |  | Thermal processor instability can cause OS crash (ScientificProgrammer: Sat, Jul 19, 2003, 1:13 pm) |
| | | | | | | | | | | | aargh (jay: Tue, Aug 16, 2005, 10:10 pm) |
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