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dude - ease up on the jargon and de-word
Wednesday, August 10, 2005 at 3:26 pm
Windows XP Annoyances Discussion Forum
Posted by paulatlanta
(1 messages posted)
did you ever read a newspaper?
word conservation is en vogue.
so is white space, and pargraphs.
On Saturday, July 19, 2003 at 1:13 pm, ScientificProgrammer wrote:
>I was reusing an old heat sink (and fan) for building up an MSI motherboard. Since
>the phase change thermal pad on the AMD Athlon heatsink is single use, I had to
remove
>the old thermal pad and replace it with a new one. The new thermal pad must be
applied
>evenly, without lumps or voids. Any lumps or voids in the thermal pad will cause
>hot spots on the processor die, which will increase the likelihood of instability
>and processor damage. The motherboard’s temperature sensor will not detect
>these hotspots because the sensor is on the opposite side of the processor package
>from the heat-producing die. Here’s what I did: First, I marked the location
>of the old thermal pad. Then I scraped off most of the old thermal pad using a
wooden
>‘popsicle’ stick to avoid scratching the soft aluminum heatsink (a plastic
>knife would also work). Then I removed the remaining residue of the old thermal
>pad with a petroleum solvent. I rinsed away the petroleum residue with electronic
>contact cleaner. I selected a 0.2mm thick Boron Nitride thermal pad with a thermal
>resistance of 0.03degC/W for the new AMD processor. The new thermal pad came packaged
>between two plastic (Mylar) sheets. I warmed the heat sink before applying the
new
>thermal pad to assist in adhesion. Remove the plastic sheet from one side of the
>new thermal pad and apply it to the warm heat sink using gentle pressure. There
>can’t be any air bubbles. The plastic sheet on the other side of thermal pad
>may tend to stick and not release cleanly, which causes lumps and voids in the thermal
>pad rendering it unusable. To avoid this problem, chill the heat-sink in the freezer
>before attempting to remove the plastic sheet from the processor side of the new
>thermal pad. This process should yield a smooth thermal pad without lumps or voids
>for maximum heat transfer from the processor, without hotspots and thermal-induced
>processor instability.
>
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All messages in this thread [show all]
 |  | | | | | | | | |  | dude - ease up on the jargon and de-word (paulatlanta: Wed, Aug 10, 2005, 3:26 pm) |
| | | | | | | | | | | | aargh (jay: Tue, Aug 16, 2005, 10:10 pm) |
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